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| SE2600S 2.4 GHz WLAN Switch/LNA Front End Preliminary Applications IEEE802.11b DSSS WLAN IEEE802.11g,n OFDM WLAN Embedded applications Product Description The SE2600S is a single chip integrated front-end module (FEM) with a Bluetooth port to complement WLAN chipsets with integrated Power Amplifier. The FEM integrates SP3T Switch and Low Noise Amplifier with bypass mode in an ultra compact package. It is capable of switching between WLAN RX, WLAN TX and BluetoothTM Features Integrates SP3T Switch and LNA with by-pass mode 12 dB gain, 1.8 dB NF 0.5 dB Bluetooth path loss 1.07x1.05x 0.38mm, 250 um pitch, SnAg solder bump Lead free, Halogen free and RoHS compliant Ordering Information Part No. SE2600S SE2600S-R SE2600S-EK1 Package 11 pin CSP 11 pin CSP N/A Remark Samples Tape and Reel Evaluation kit Functional Block Diagram BT 1 4 2 Vdd RFC 3 RX 4 TX 1 2 3 4 Figure 1: Functional Block Diagram DST-00292 Rev 1.4 October-09-2009 Von Vc1 Vc2 Vc3 1 of 12 SE2600S 2.4 GHz WLAN Switch/LNA Front End Preliminary http://www.sige.com Email: sales@sige.com Customer Service Locations: North America: 1050 Morrison Drive, Suite 100 Ottawa ON K2H 8K7 Canada Phone: +1 613 820 9244 Fax: +1 613 820 4933 Hong Kong Phone: +852 3428 7222 Fax: +852 3579 5450 San Diego Phone: +1 858 668 3541 (ext. 226) Fax: +1 858 668 3546 United Kingdom Phone: +44 1279 464217 Fax: +44 1279 464201 Product Preview The datasheet contains information from the product concept specification. SiGe Semiconductor, Inc. reserves the right to change information at any time without notification. Preliminary Information The datasheet contains information from the design target specification. SiGe Semiconductor, Inc. reserves the right to change information at any time without notification. Production testing may not include testing of all parameters. Information furnished is believed to be accurate and reliable and is provided on an "as is" basis. SiGe Semiconductor, Inc. assumes no responsibility or liability for the direct or indirect consequences of use of such information nor for any infringement of patents or other rights of third parties, which may result from its use. No license or indemnity is granted by implication or otherwise under any patent or other intellectual property rights of SiGe Semiconductor, Inc. or third parties. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. SiGe Semiconductor, Inc. products are NOT authorized for use in implantation or life support applications or systems without express written approval from SiGe Semiconductor, Inc. Copyright 2009 SiGe Semiconductor, Inc. All Rights Reserved DST-00292 Rev 1.4 October-09-2009 12 of 12 |
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